中文
Diamond wire is mainly used for high-precision cutting and forming processing in the microcrystalline glass industry. It is a core tool to solve the problem of high hardness and brittleness processing of microcrystalline glass, and can significantly improve processing efficiency and product quality. Its core application scenarios and advantages are as follows:
Plate/sheet cutting: Precise cutting of microcrystalline glass raw materials for building decorative panels, electronic substrates (such as display screen backboards), etc., with smooth cutting and low edge breakage rate, reducing the cost of subsequent polishing processes.
Irregular processing: For home appliance panels (such as stove panels), optical components and other irregular structures, diamond wire can achieve complex curve cutting to meet customized styling needs.
High efficiency and low consumption: Compared with traditional grinding wheel cutting, diamond wire cutting has faster speed, less consumable consumption, and lower dust pollution, which meets the industry's environmental protection and cost reduction needs.
Thin processing: In the electronic field, precision control of cutting thickness can be achieved in the processing of microcrystalline glass flakes (thickness below millimeter level), ensuring material flatness and mechanical strength.
Product Specifications
Specification Model | Finished product line diameter(mm) | Breaking force（N） | purpose |
0.25Electroplated diamond wire | 0.25±0.01 | ≥90 | Microcrystalline glass processing |
0.23Electroplated diamond wire | 0.23±0.01 | ≥75 | Microcrystalline glass processing |
0.22Electroplated diamond wire | 0.222±0.01 | ≥70 | Microcrystalline glass processing |
0.20Electroplated diamond wire | 0.20±0.01 | ≥55 | Microcrystalline glass processing |
0.18Electroplated diamond wire | 0.18±0.01 | ≥45 | Microcrystalline glass processing |
0.17Electroplated diamond wire | 0.17±0.01 | ≥40 | Microcrystalline glass processing |
0.16Electroplated diamond wire | 0.16±0.01 | ≥35 | Microcrystalline glass processing |
0.15Electroplated diamond wire | 0.15±0.01 | ≥35 | Microcrystalline glass processing |
0.14Electroplated diamond wire | 0.14±0.01 | ≥30 | Microcrystalline glass processing |
0.12Electroplated diamond wire | 0.12±0.01 | ≥24 | Microcrystalline glass processing |
0.10Electroplated diamond wire | 0.105±0.01 | ≥22 | Microcrystalline glass processing |
0.09Electroplated diamond wire | 0.095±0.01 | ≥18 | Microcrystalline glass processing |
0.08Electroplated diamond wire | 0.085±0.01 | ≥13 | Microcrystalline glass processing |
*Customization can be developed based on processing and usage requirements
ICP：湘ICP备2025139849号-1 
