中文
Used for cutting magnetic materials, with high automation, minimal product fluctuations, multiple lines per machine, high capacity utilization, and high cutting efficiency. The core application of diamond wire in the magnetic material industry is high-precision cutting of hard and brittle magnetic materials, especially for sintered neodymium iron boron, samarium cobalt and other magnets with high hardness (Mohs hardness 5-6) and prone to edge breakage, achieving efficient slicing and billet making.
The specific application scenarios and advantages are as follows:
Core scenario: It is mainly used to cut magnetic material blanks into thin sheets, strips, or specific shaped blanks, and is a key preceding process for the processing of magnetic materials from blanks to finished products.
Core advantages: Compared with traditional sand wire cutting, the cutting efficiency is greatly improved, the incision is narrower (reducing material loss), and the magnetic material surface has fewer broken edges and cracks, directly reducing the subsequent polishing cost.
Product Specifications
Specification Model | Finished product line diameter(mm) | Breaking force（N） | Purpose |
0.25Electroplated diamond wire | 0.25±0.01 | ≥90 | Cutting magnetic materials into blocks and strips |
0.23Electroplated diamond wire | 0.23±0.01 | ≥75 | Cutting magnetic materials into blocks and strips |
0.22Electroplated diamond wire | 0.222±0.01 | ≥70 | Cutting magnetic materials into blocks and strips |
0.20Electroplated diamond wire | 0.20±0.01 | ≥55 | Magnetic material slice |
0.18Electroplated diamond wire | 0.18±0.01 | ≥45 | Magnetic material slice |
0.17Electroplated diamond wire | 0.17±0.01 | ≥40 | Magnetic material slice |
0.16Electroplated diamond wire | 0.16±0.01 | ≥35 | Magnetic material slice |
0.15Electroplated diamond wire | 0.15±0.01 | ≥35 | Magnetic material slice |
0.14Electroplated diamond wire | 0.14±0.01 | ≥30 | Magnetic material slice |
0.12Electroplated diamond wire | 0.12±0.01 | ≥24 | Magnetic material slice |
0.10Electroplated diamond wire | 0.105±0.01 | ≥22 | Magnetic material slice |
0.09Electroplated diamond wire | 0.095±0.01 | ≥18 | Magnetic material slice |
0.08Electroplated diamond wire | 0.085±0.01 | ≥13 | Magnetic material slice |
*Customization can be developed based on processing and usage requirements
ICP：湘ICP备2025139849号-1 
