Diamond wire is a key tool for achieving high-precision and low damage cutting in precision ceramic processing (such as alumina ceramics and zirconia ceramics), especially suitable for the high hardness and easy cracking characteristics of ceramic materials, covering the entire core processing process from the blank to the finished product.

      Its core application scenarios and technological advantages are as follows:

      Rough cutting of ceramic block bodies: Cutting ceramic block bodies into thin sheets or preliminary formed parts can increase efficiency by more than 40% compared to traditional cutting, reduce body loss, and lower raw material costs.

      Precision slicing: For electronic ceramics (such as ceramic substrates and sensor ceramic chips), 0.1-1mm thin slicing can be achieved with a cutting tolerance controlled within ± 0.01mm, ensuring the accuracy requirements of subsequent coating and packaging processes.

      Irregular processing: For ceramic bearing rings, medical ceramic components (such as dental crowns, orthopedic implants) and other irregular structures, it can accurately cut complex shapes such as arcs and grooves, with edge smoothness Ra ≤ 1.6 ㎛, reducing polishing processes.

      Porous ceramic cutting: For porous ceramic filter elements, it can avoid pore blockage or structural damage caused by traditional cutting, and maintain stable material porosity and filtration performance.

      Low damage processing: During the cutting process, the stress is small, which can reduce internal microcracks in ceramic parts and improve the flexural strength of the finished product. It is especially suitable for precision processing of high toughness ceramics such as zirconia.

Product Specifications

*Customization can be developed based on processing and usage requirements