中文
The specialized wire for sapphire slicing has advantages such as high stability, high cutting efficiency, and resistance to breakage. Thanks to the unique automation control system, smaller fluctuations in sand volume can be achieved, ensuring consistency in cutting products, even distribution of sand volume, and high cutting efficiency; The production process operates under high-definition monitoring equipment and is traceable; Special processing technology, the diamond wire has good toughness and is not easily broken, and has good wear resistance.
Sapphire has a high hardness (Mohs hardness level 9), and traditional cutting methods are difficult to effectively process. However, diamond wire saw cutting technology, which is a fixed abrasive multi wire cutting technology, is suitable for cutting hard and brittle materials such as sapphire because its cutting seam is less than 0.5mm. Compared with traditional mortar cutting technology, diamond wire cutting has the advantages of high cutting speed, good slicing quality, low material loss, and easy sawdust recycling.
Product Specifications
Specification Model | Finished product line diameter(mm) | Breaking force（N） | purpose |
0.16Electroplated diamond wire | 0.16±0.01 | ≥30 | Electroplated diamond wire |
0.18Electroplated diamond wire | 0.18±0.01 | ≥45 | Electroplated diamond wire |
0.20Electroplated diamond wire | 0.20±0.01 | ≥55 | Electroplated diamond wire |
0.22Electroplated diamond wire | 0.22±0.01 | ≥70 | Electroplated diamond wire |
0.23Electroplated diamond wire | 0.23±0.01 | ≥75 | Electroplated diamond wire |
0.25Electroplated diamond wire | 0.25±0.01 | ≥90 | Electroplated diamond wire |
*Customization can be developed based on processing and usage requirements
ICP：湘ICP备2025139849号-1 
