中文
The application of diamond wire in the stone industry has improved the efficiency and quality of stone processing, reduced material loss and environmental pollution, and promoted the development of the stone industry.
Mainly reflected in the following aspects:
Board cutting: can be used to cut large slabs of hard stone such as marble and granite. Compared to traditional sand saws, diamond wire cutting has narrower seams, which can improve material yield. It also has advantages such as low energy consumption, low material consumption, and low noise, and the cutting surface is flat and smooth with uniform thickness. In addition, diamond wire can directly cut ultra-thin plates with a thickness of 3 millimeters without the need for secondary cutting.
Irregular stone processing: Traditional stone cutting uses large saw blades, which are difficult to process irregular and curved stones. Diamond wire can flexibly cut various complex shapes, such as stone crafts, irregular tombstones, etc., to meet different processing needs.
Product Specifications
Specification Model | Finished product line diameter(mm) | Breaking force（N） | purpose |
0.65mmElectroplated diamond wire | Φ0.65±0.03 | ≥490 | Stone slicing |
0.55mmElectroplated diamond wire | Φ0.55±0.03 | ≥400 | Stone slicing |
0.50mmElectroplated diamond wire | Φ0.50±0.02 | ≥380 | Stone slicing |
0.45mmElectroplated diamond wire | Φ0.45±0.02 | ≥280 | Stone slicing |
0.40mmElectroplated diamond wire | Φ0.40±0.02 | ≥220 | Stone slicing |
0.35mmElectroplated diamond wire | Φ0.35±0.02 | ≥160 | Stone slicing |
*Customization can be developed based on processing and usage requirements
ICP：湘ICP备2025139849号-1 
